Meet Voxtel’s Leaders
George M. Williams Jr.
George M. Williams Jr. is the chairman of the board, president, and chief executive officer of Voxtel. He oversees the strategic direction of the Voxtel companies.
Before taking the helm at Voxtel, Williams was General Manager at Scientific Imaging Technologies inc. (SITe) and PixelVision Inc.; there, he was a part of the management group that led a successful spinout from Tektronix, delivering the first generation of science grade CCDs and back-illuminated CCD cameras for applications ranging from the Hubble Space Telescopes (HSTs) camera to digital mammography, protein crystallography, microscopy, and spectroscopy applications. Williams joined the SITe/PixelVision management team after holding lead positions at ITT Night Vision, Photon Research Associates (PRA), and New England Research Corporation (NERC), where he led advanced development and manufacturing teams developing advanced solid state and image tube sensors for helmet mounted night vision goggle (NVG), x-ray, and infrared imaging applications.
A native of Niskayuna, NY, Williams earned a B.S. in Electrical Engineering from Union College in 1986, an M.S.E.E. from Northeastern University in 1989, and an M.B.A. from Virginia Polytechnical University in 1993. He is married and has two children. He enjoys skiing, hiking, and yoga.
Adam Lee is the Group Lead of Voxtel’s Readout Integrated Circuit (ROIC) and CMOS Imager design group. In that role, he manages a design group and participates in the development of high-resolution CMOS and SOI CMOS ROICs, including radiation-hardened designs, with performance ranging from extremely low-noise video-rate imaging to those requiring ps-scale time-of-flight and GHz-bandwidth temporal sampling, such as are used in active/passive imaging and LADAR FPAs. His designs have included event-driven readout, waveform sampling, and threshold active time-of-flight (TOF)/passive imaging features in small-unit-cell linear and 2D imaging formats. He is familiar with a broad range of CMOS processes at both domestic and foreign foundries. He is actively involved in the optical/electrical test of high-performance imaging arrays and ROICs at both room and cryogenic temperatures. Prior to Voxtel, Mr. Lee worked for four years at Teledyne Imaging/Rockwell Scientific, LLC, as an IC design engineer in their imaging division, responsible for monolithic CMOS image sensors using the 0.13‑μm pinned PD (4T) process, and with particular experience in low-noise switched-capacitor amplifiers, programmable-gain amplifiers, analog output drivers, and horizontal and vertical scanners. Prior to working for Teledyne Imaging, Mr. Lee worked at LSI Logic Corporation as an analog IC design engineer in their high-speed interface division, where he was responsible for gigabit-rate transceiver design in the 0.13‑μm CMOS process for USB, Fibre Channel, and SCSI interfaces.
Mr Lee obtained both his BSEE (2000) and MSEE (2003) from Iowa State Univ.
Dr. Andrew Huntington manages Voxtel’s Semiconductor Detector and Device Development Group and is responsible for Voxtel’s advanced development efforts relating to semiconductor devices, material growth, device modeling, and detector design and development efforts. He invented and patented Voxtel’s advanced high-gain, low-excess-noise SCM-APD technologies, and has supported this important device’s development through Monte Carlo modeling and experimental extraction of the material’s properties. He has also managed the development of Voxtel’s array process and APD-based commercial products. The detector projects Dr. Huntington has conducted include Geiger- and linear-mode SOI CMOS and InGaAs-based APDs for the NIR; HgCdTe APDs for the SWIR, MWIR, and LWIR; and silicon-based linear APDs for visible and X‑ray applications. He has a number of publications detailing this work.
Prior to joining Voxtel, Dr. Huntington performed his doctoral studies in materials at the University of California, Santa Barbara (L. Coldren Group), where his dissertation work included development of low-noise and broad-area InGaAs/InAlAs APDs. That work was conducted in collaboration with Professor Joe Campbell of the University of Texas, Austin, who is widely recognized as a leader in the field. Conducting this work, Dr. Huntington developed his expertise in the production of APD wafers by molecular beam epitaxy, with particular emphasis on understanding the relationship between growth conditions, material quality, and device performance. Dr. Huntington is a US citizen and holds a DoD Secret security clearance.
Dr. Huntington obtained his doctorate in Chemistry from the University of California Santa Barbara (UCSB) in 2003 and obtained a BS in Chemistry from Caltech in 1997.
John Paul Harmon
John Paul (Paul) Harmon is manager of Nanophotonics and Devices at NanoVox, a division of Voxtel. Paul has wide experience making inventions real, ranging from technology conception to final product delivery and production, from detailed design to corporate system strategy. Paul Harmon was variously Director of Technology Development, of Engineering, and of Mfg Operations for Trimble MCS from 2005 through 2011. He created partnerships with internal divisions, Hilti and Nikon to develop rugged outdoor mobile computers and software applications. Technology (e.g., Qualcomm’s MEMs display, GPS) was selected to deliver a tuned competitive edge.
Before working at Trimble Mr. Harmon was a section manager of the Advanced Research Lab of the Hewlett Packard Inkjet Business Unit. His staff developed technology for thermal inkjet pens, inks, supplies, and writing systems.
Mr. Harmon holds 43 issued Patents worldwide. Representing HP, he was elected Vice-chairman, International SemaTech Executive Steering Council in late 2004.
He earned his BSME at the University of Washington. Harmon serves on multiple advisory boards for universities and organizations, and volunteers his time to manage a worldwide non-profit organization.